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Facilities

Our advanced facilities.

Main Equipment

  • Die bonder

Equipment for mounting LED chips on the tip of vertical leadframes

Maker

ASM Pacific Technology Ltd.

Model

AD100MM
(Vertical LED )

System Capability

Cycle time 180ms
XY placement ±1.5 mil (±38.1 mm) @3σ
Die rotation ±5°@3σ

Material Handling Capability

Die size
6x6 mil - 50x50 mil
(0.15x0.15mm - 1.27x1.27 mm)

Vertical lead frame

Length 110 -260mmM
Height 20-50mm
Thickness 0.13-0.76 mm
Pitch 5-12 mm

  • Wire bonder

Equipment for wiring mounted chips with gold wire

Maker

Kulicke & Soffa Industries Inc.

Model

Connx Elite VLF

Wire Bonding Capability

Bonding Area X Axis 56mm Y Axis 20mm

Total Bonding Placement Accuracy

3.0μm @3σ

Looping Capability

Maximum Wire Length　8mm Minimum loop Hight　65μm

Wire Sway

Maximum Wire Length　8mm Minimum loop Hight　65μm

  • Molding equipment
Molding equipment

Equipment for molding the resin part at the tip of LED lamps.

Maker

Chang-Yu Technology Co., Ltd.

Model

H200

Machine speed

depending on baking time, up to 20K Applicable aluminum bar size：220mm long (Double-combined aluminum boat)

Applicable support tray

125(W)
*158(L)
*53(H)mm

Machine size

5800(W)
*2,000(L)
*1,600(H)mm

  • Lead soldering equipment
Lead soldering equipment

Equipment for solder dipping lead frames

Maker

Ideya Corporation

Model

STT37-001(D/W775)

Basic Specifications

Target workpiece:
 Through-Hole LED
Head diameter:
 φ 3mm - φ 10mm
Lamp length:
 4.8mm - 13.6mm
Lead length:
 max 34mm
Frame length:
 140mm - 152.4mm
Frame thickness:
 0.4mm - 0.5mm

Production capacity

8 sheets/chuck x 3,600sec/28sec = 1,028 sheets/hour

  • Characteristic inspection equipment
Characteristic inspection equipment

Equipment that performs optical and electrical measurements on LED lamps to sort and rank good/defective products.

Maker

MANJER ENGINEERING CO., LTD

Model

LPAT-4300B

Measurement Items Accuracy

1. Kelvin Contact Check
2. Forward Voltage
3. Forward Current
4. Reserve Voltage
5. Reserve Current
6. Delta Vf :△Vf Condition
7. Thyristor Effect
8. Luminous Intensity
9. Luminous Flux
10.Dominant Wavelengt
11. Peak Wavelength
12. Centriod Wavelength
13. Chromaticity Co-ordinates x and y ±0.005
14. Uniform Chromaticity Scale u' and v' 15.Correlated Color temperature (CCT) 16.Color Rendering Index (CRI)

  • Taping equipment
Taping equipment

Equipment for attaching LED lamps to mounts (See figure on the right)

condensers

Maker

AUTOP Precision Machinery

Model

TPC-200

Specifications

・Taping Pitch 12.7 mm.
・Forming Pitch 2.5 - 7.5 mm.
・Forming Style: Straight, Bend in / out.
・Cam driven forming, stable & accurate.
・Long Lasting Mechanical Parts.
・PLC Control System, Easy Operations.
・Inverter Speed Control.
・HMI User Friendly Status Display.

Do you have any question? Please contact us. >>   Contact

Toricon Co., Ltd

Postal Code: 696-0102 3825-8, Nakano, Ohnan-cho Ochi-gun, Shimane, Japan

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