This page explains how our products are produced.
Toricon’s LED manufacturing process is as follows.
- Die Bonding
- Wire Bonding
- Silver Reinforcement (optional)
- Resin Mold
- Tie-Bar Cutting
- Solder Dipping
- Test
- Shearing
- Sorting
Before explaining the process, we will first explain the materials.
Material
LED consists of an LED chip that emits light, a lead frame that mounts the chip, adhesive paste that connects them, bonding wire between chip and frame, and epoxy resin that serves as both a protective cover and a lens.
Die Bonding Process
Apply adhesive paste to the bottom of the leadframe cup.
Die bonding machine stamps adhesive paste to the bottom of the leadframe cup, and picks LED chips arranged on the sheet one by one at high speed and places them on the adhesive paste. The process of mounting LED chip on lead frame is called die bonding.
Adhesive paste has the property of hardening with heat, so the product is placed in an electric furnace.
Wire Bonding Process
Connect the surface electrode of the LED element placed on the lead frame to the tip of the lead frame on the opposite side using a gold wire. At this time, each bonding surface becomes alloyed and bonded by ultrasonic waves. We use BBOS (Bonding Ball On Stitch), which covers the adhesive surface with a ball-shaped gold layer to increase strength.
This process is called wire bonding.
Silver Reinforcement Process (optional)
BBOS provides sufficient strength in normal situations, but in high stress environments with repeated high and low temperatures, the bonded surface may peel off.
We can ensure extremely high reliability by covering the BBOS with silver paste as an optional process.
Mold Process
To create the lens part of the LED lamp, resin is mixed and poured into a resin mold. By mixing additives with the resin, enable change the way the lamp shines and the color of the light.
Insert the wire-bonded lead frame into the resin-filled mold. The resin mold determines the lens shape.
The resin is thermoset in an electric furnace.
Tie-bar Cutting Process
Press cutting machines cut the tie-bar and the part of the cathode lead so that the LED can be lit for inspection.
Solder Dipping Process
Solder dip the lead frame. This has the effect of preventing corrosion and making soldering mounting easier. Almost all products are solder dipped, but you can optionally skip this step.
Inspection Process
Checking for defects such as scratches, deformation and non-lighting.
Shearing Process
Cut the tie-bar at the bottom of the lead frame to separate the LEDs.
Characteristic Sorting Process
Inspection is performed by lighting an LED in the inspection device, and the products are automatically sorted according to the degree of light emission.
Even products of the same color may have slightly different luminescence.
In order to create uniform products, we separate them according to the degree of luminescence.
The above is the LED manufacturing process.
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